- 8-channel ES9038PRO*2
- 8-channel THX AAA 788+
- DC/AC dual power supply design
- Separate analog and digital power supplies
- 6-inch FHD + Portrait screen + Android open OS
- Supports ten operating modes including HDMI ARC/Roon Ready
8-channel ES9038PRO DAC*2
With the ES9038PRO having been featured in the M17, Q7, K9 Pro SS and M15S, we now have much experience with the chip to enable it to push audio quality to new heights. The R9 employs two ES9038PRO DACs, one each for the left and right channels. Each DAC chip contains 8 independent D/A converters, and these 8 channels are connected in parallel for a fully differential output. The result is precise, clear yet full sound.
DNR: 132dB | THD+N: -122dB
Next-gen THX AAA 788+ headphone amplifier
Inside the R9 is an 8-channel THX AAA 788+ headphone amplifier design. These headphone amps, fed by a high-voltage power supply, are connected in parallel via 2×2 groups for a four-way fully balanced design, greatly enhancing transient performance. The comb-shaped heat sinks and optimized circuit layout dissipate heat efficiently, ensuring the R9 is capable of continuous and stable high-power output. The result is that the R9 is capable of outputting 7300mW per channel at 32Ω, 102% higher than that of R7.
*THD+N per channel under 32Ω goes up to
Five gain levels
The R9 boasts impressive audio performance thanks to its five-stage audio architecture with carefully-crafted IV, LPF, gain, pre-amplification, and current expansion stages. An important part of the audio circuit is the OPA2211 op-amps, which are made through the silicon-germanium (SiGe) CMOS manufacturing process that ensures the chip’s excellent performance.
The variable gain and variable power supply voltage design result in 5 levels of gain, allowing you to exactly dial in your desired listening volume. No matter if you are using IEMs or hard-to-drive headphones, you will get a great listening experience.
DC/AC dual power supplies
Built into the R9 is a new 40W low-noise, high-efficiency, long-lasting industrial-grade power supply, supporting an ultra-wide range of input voltages (85~305VAC) and capable of operating under a wide range of temperatures (-40℃~85℃) as well as rated for lasting 500,000 hours. The R9 can also be powered by an external DC power supply*, allowing you to pair the R9 with a high-performance linear power supply that offers its own sound. Additionally, when the R9 is paired with an external AC power supply, you can choose to enable the “Ground Lift” functionality to reduce crosstalk for purer sound.
*15V-3A external DC power supplies are supported
Separate analog and digital power supplies
The R9 features separate power supplies for the digital and analog portions of the audio circuit, avoiding crosstalk between the digital/analog parts and achieving better isolation and shielding between the two portions.
Finely-divided analog portion
The analog portion of the audio circuit features a finely-divided multiple-stage power supply, including digital-to-analog conversion, LPF, pre-stage processing, amplification drive and other power supply stages. Each power supply stage uses many precision LDOs for secondary voltage stabilization, further ensuring a clean and stable supply of power.
Large 6-inch HD screen
The R9 features a tall 6-inch 2160*1080 vertical (portrait) screen combined with the open Android OS for a thoroughly intuitive experience. The open Android OS not only allows the user to freely install and use third-party streaming music and other apps, it is also thoroughly refined so that the user does not have to worry about app compatibility problems.
Modular design
Qualcomm Snapdragon 660: With several years’ worth of experience in fine-tuning this “core” combined with the open Android system, FIIO offers a silky-smooth experience on the R9.
*FIIO is planning to upgrade the OS to Android 12 in Q1 2024
XMOS 16 core XU316: High performance, low latency, supports 768kHz/32bit and DSD512
Qualcomm QCC5125: Many codecs supported, Bluetooth reception supports LDAC/aptX Adaptive/aptX LL/aptX HD/aptX/AAC/SBC
HDMI IN/OUT/ARC modes
HDMI IN: Connect to computers/game consoles/Blu-ray players and other devices through HDMI IN, and connect to monitors and other similar devices through HDMI OUT for a high-resolution audio and high-definition visual experience.
HDMI OUT: Connect to an external TV/monitor through HDMI OUT for a better remote-control experience on a larger screen.
HDMI ARC: Allows you to connect devices such as TVs and Blu-ray players, and then connect to the FIIO SP3 and other similar sound equipment through the RCA or XLR outputs for high-quality audio.
All kinds of connectors
Front connectors
- 6.35mm headphone output
- 4.4mm balanced headphone output
- 4-pin XLR balanced headphone output
Specifications
Main SoC: Qualcomm Snapdragon 660
OS: Heavily customized Android 10 (FIIO is planning to upgrade the OS to Android 12 in Q1 2024)
DAC: 8-channel ES9038PRO*2
Headphone amp: Quad THX AAA 788+
Bluetooth chip: QCC5125
Bluetooth version: 5.1
Bluetooth codec support: LDAC/aptX Adaptive/aptX LL/aptX HD/aptX/AAC/SBC
USB: XMOS XU316
USB DAC: 768kHz/32bit, DSD512
USB type: Type-C USB3.0, USB-A
Display: 6-inch FHD + bezel-less screen (2160*1080)
Output power 1: L+R≥7300mW+7000mW (32Ω, BAL, THD+N＜1%, Ultra high gain mode)
Output power 2: L+R≥1000mW+1000mW (300Ω, BAL, THD+N＜1%, Ultra high gain mode)
Frequency response: 20Hz~80kHz (0.9dB)
Signal-to-noise ratio: ≥126dB (A-weighted)
Noise floor1: LO≤1.4μV (A-weighted); PO≤4μV (A-weighted)
Noise floor2: BAL LO≤1.9μV (A-weighted); BAL≤7μV (A-weighted)
Output impedance: ＜0.6Ω (32Ω load)
THD+N≤0.0002% (1kHz/-1.8dB@32Ω)
RAM: 4GB
Internal storage: 64GB/actually available 46GB
Memory card support: Standard microSD card slot, supports up to 2TB
Dimensions:
About 115x127x160mm (excluding base)
About 115x127x170mm (including base)
About 115x127x182.5mm (including 7° slanted base)
Weight: About 2271g